From LED to Solid State Lighting

Name: From LED to Solid State Lighting
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SKU: 9781118881477
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Principles, Materials, Packaging, Characterization, and Applications

By S. W. Ricky Lee and Jeffery C. C. Lo and Mian Tao and Huaiyu Ye

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Summary

From LED to Solid State Lighting delves into the technological advancements and applications of light-emitting diodes transitioning to solid-state lighting. The authors explore the principles and innovations behind this transformation, focusing on engineering solutions and practical implementations that enhance energy efficiency and lighting performance. This work serves as a comprehensive guide for professionals in the field, offering insights into both the potential and challenges of this significant shift in lighting technology.
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Format: Hardback

$247⁹⁹

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From LED to Solid State Lighting

$247⁹⁹

Book Hero Magic created this recommendation. While it's new and still learning, it may not be perfect - your feedback is welcome! IS THIS YOUR NEXT READ?

You might enjoy this book if you have an interest in the evolution and engineering of lighting technology, especially the transition from traditional lighting systems to modern LED and solid-state solutions. It's perfect for those keen to explore the technical advances and innovations shaping the future of lighting.

Description

From LED to Solid State Lighting

A comprehensive and practical reference complete with hands-on exercises and experimental data.

In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features.

Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material.

This important book also includes:

Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips.
Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization.
Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization.
In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting.

Perfect for post-graduate students and practising engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Book Details

INFORMATION

ISBN: 9781118881477

Publisher: John Wiley & Sons Inc

Format: Hardback

Date Published: 18 October 2021

Country: United States

Imprint: John Wiley & Sons Inc

Audience: Tertiary education, Professional and scholarly

DIMENSIONS

Spine width: 16.0mm

Width: 170.0mm

Height: 244.0mm

Weight: 610g

Pages: 256

Collections

Education & Reference Engineering, Technology & Agriculture Huaiyu Ye Jeffery C. C. Lo Mian Tao Non-Fiction S. W. Ricky Lee

About the Author

Shi-Wei Ricky Lee, PhD, received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Mechanical and Aerospace Engineering and Director of Foshan Research Institute for Smart Manufacturing at the Hong Kong University of Science and Technology (HKUST).

Jeffery C. C. Lo, PhD, received his Bachelor (1st Class Honour) and MPhil degrees in Mechanical Engineering from the Hong Kong University of Science and Technology (HKUST) in 2002 and 2004 respectively. He is currently the Program Manager at the Center for Advanced Microsystems Packaging at HKUST and Assistant Director of FRISM.

Mian Tao, PhD, received his MSc degree from the Hong Kong University of Science and Technology (HKUST) in Mechanical Engineering in 2010 and PhD degree in 2016. His research interests include thermal characterization and management of high power electronics and development of advanced microelectronic packages.

Huaiyu Ye, PhD, received his PhD degree from the Department of Microelectronics, Delft University of Technology in 2014. Currently he is Associate Professor of Southern University of Science and Technology (SUSTech).